Structure for microelectronic packaging with terminals on dielectric mass

Patent metadata

Field	Value
Publication number	US-8975738-B2
Application number	US-201213674280-A
Country	US
Kind code	B2
Filing date	Nov 12, 2012
Priority date	Nov 12, 2012
Publication date	Mar 10, 2015
Grant date	Mar 10, 2015

Abstract

A structure may include a spacer element overlying a first portion of a first surface of a substrate; first terminals at a second surface of the substrate opposite the first surface; and second terminals overlying a third surface of the spacer element facing away from the first surface. Traces extend from the second terminals along an edge surface of the spacer element that extends from the third surface towards the first surface, and may be electrically coupled between the second terminals and the first terminals or electrically conductive elements at the first surface. The spacer element may at least partially define a second portion of the first surface, which is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some of the conductive elements are at the second portion and may permit connection with such microelectronic element.

First claim

The invention claimed is:

1. A structure comprising:
a substrate having first and second oppositely facing surfaces, a plurality of electrically conductive elements at the first surface, and a plurality of first terminals at the second surface configured for connection to a first component, at least some of the first terminals electrically connected with the conductive elements;
a spacer element overlying a first portion of the first surface, the spacer element having a third su…

Assignees

• Invensas Corp

Inventors

• Haba Belgacem
• Mohammed Ilyas

Classifications

• H10W90/724

  Electricity · mapped topic

• H10W90/722

  Electricity · mapped topic

• H10W74/117

  Electricity · mapped topic

• H10W74/014

  Electricity · mapped topic

• H10W72/252

  Electricity · mapped topic