Wideband transition between a planar transmission line and a waveguide
US-2015357698-A1 · Dec 10, 2015 · US
Transmission line for electronic circuits
US8975737B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8975737-B2 |
| Application number | US-201113279138-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 21, 2011 |
| Priority date | Oct 27, 2010 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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Abstract
Official abstract text for this publication.
A transmission line formed in a device including a stack of first and second chips having their front surfaces facing each other and wherein a layer of a filling material separates the front surface of the first chip from the front surface of the second chip, this line including: a conductive strip formed on the front surface side of the first chip in at least one metallization level of the first chip; and a ground plane made of a conductive material formed in at least one metallization level of the second chip.
First claim
Opening claim text (preview).
What is claimed is: 1. A transmission line formed in a device comprising: a stack of first and second chips having their front surfaces facing each other and wherein a layer of a filling material separates the front surface of the first chip from the front surface of the second chip, the transmission line comprising: a conductive strip formed on the front surface side of the first chip in at least one metallization level of the first chip; and a ground plane of a conductive ma…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8975737B2 cover?
- A transmission line formed in a device including a stack of first and second chips having their front surfaces facing each other and wherein a layer of a filling material separates the front surface of the first chip from the front surface of the second chip, this line including: a conductive strip formed on the front surface side of the first chip in at least one metallization level of the fir…
- Who is the assignee on this patent?
- Bar Pierre, Joblot Sylvain, Carpentier Jean-François, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H01P3/082. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).