Semiconductor device and method of manufacturing the same
US-2015357264-A1 · Dec 10, 2015 · US
Redistribution board, electronic component and module
US8975735B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8975735-B2 |
| Application number | US-201313962622-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 8, 2013 |
| Priority date | Aug 8, 2013 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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Abstract
Official abstract text for this publication.
A redistribution board includes a first conductive layer including a redistribution structure for low voltage signals, a second conductive layer including a redistribution structure for high voltage signals, and a non-conductive layer. The second conductive layer is spaced apart from the first conductive layer by the non-conductive layer. The redistribution board further includes a conductive connector extending from a mounting surface of the redistribution board to the second conductive layer. The conductive connector is surrounded by a low voltage trace of the first conductive layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A redistribution board, comprising: a first conductive layer comprising a redistribution structure for low voltage signals; a second conductive layer comprising a redistribution structure for high voltage signals; a non-conductive layer, the second conductive layer being spaced apart from the first conductive layer by the non-conductive layer; and a conductive connector extending from a mounting surface of the redistribution board to the second conduct…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W70/411Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8975735B2 cover?
- A redistribution board includes a first conductive layer including a redistribution structure for low voltage signals, a second conductive layer including a redistribution structure for high voltage signals, and a non-conductive layer. The second conductive layer is spaced apart from the first conductive layer by the non-conductive layer. The redistribution board further includes a conductive c…
- Who is the assignee on this patent?
- Infineon Technologies Ag
- What technology area does this patent fall under?
- Primary CPC classification H10W70/411. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).