Electronic device and manufacturing method thereof
US-2024404831-A1 · Dec 5, 2024 · US
Semiconductor package without chip carrier and fabrication method thereof
US8975734B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8975734-B2 |
| Application number | US-96783910-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 14, 2010 |
| Priority date | Jul 12, 2010 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A semiconductor package without a chip carrier formed thereon and a fabrication method thereof. A metallic carrier is half-etched to form a plurality of grooves and metal studs corresponding to the grooves. The grooves are filled with a first encapsulant and a plurality of bonding pads are formed on the metal studs. The first encapsulant is bonded with the metal studs directly. Each of the bonding pads and one of the metal studs corresponding to the bonding pad form a T-shaped structure. Therefore, bonding force between the metal studs and the first encapsulant is enhanced such that delamination is avoided. Die mounting, wire-bonding and molding processes are performed subsequently. Since the half-etched grooves are filled with the first encapsulant, the drawback of having pliable metallic carrier that makes transportation difficult to carry out as encountered in prior techniques is overcome, and the manufacturing cost is educed by not requiring the use of costly metals as an etching resist layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor package without a chip carrier, comprising: a plurality of metal studs spaced from each other; a first encapsulant having an top surface and a bottom surface opposing the top surface, for encapsulating lateral surfaces of the plurality of metal studs, with top surfaces and bottom surfaces of the plurality of metal studs being exposed from the first encapsulant; a plurality of bonding pads formed on and electrically connected to the plural…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8975734B2 cover?
- A semiconductor package without a chip carrier formed thereon and a fabrication method thereof. A metallic carrier is half-etched to form a plurality of grooves and metal studs corresponding to the grooves. The grooves are filled with a first encapsulant and a plurality of bonding pads are formed on the metal studs. The first encapsulant is bonded with the metal studs directly. Each of the bond…
- Who is the assignee on this patent?
- Tsai Yueh-Ying, Tang Fu-Di, Huang Chien-Ping, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10W74/016. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).