Corner layout for superjunction device

US8975720B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8975720-B2
Application numberUS-201313923065-A
CountryUS
Kind codeB2
Filing dateJun 20, 2013
Priority dateFeb 19, 2010
Publication dateMar 10, 2015
Grant dateMar 10, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A superjunction device and methods for layout design and fabrication of a superjunction device are disclosed. A layout of active cell column structures can be configured so that a charge due to first conductivity type dopants balances out charge due to second conductivity type dopants in a doped layer in an active cell region. A layout of end portions of the active cell column structures proximate termination column structures can be configured so that a charge due to the first conductivity type dopants in the end portions and a charge due to the first conductivity type dopants in the termination column structures balances out charge due to the second conductivity type dopants in a portion of the doped layer between the termination column structures and the end portions.

First claim

Opening claim text (preview).

What is claimed is: 1. A termination structure for a semiconductor device, comprising: a channel stop field plate on a surface of a semiconductor material proximate an edge of the semiconductor material, wherein the channel stop field plate includes a metal portion and an isolation portion, wherein the metal portion of the channel stop field plate contacts the semiconductor material without a heavily doped implant region or a body region and thereby forming a Schottky style channel stop, and wherein the channel stop field plate is electrically isolated by the isolation portion from areas of the semiconductor device other than where the Schottky style channel stop is formed. 2. The termination structure of the claim 1 wherein the metal portion of the channel stop field plate contacts a lowly doped portion of the semiconductor material. 3. The termination structure of claim 1 wherein the termination structure is formed on a die containing a semiconductor device, wherein the semiconductor device is a MOSFET. 4. The termination structure of claim 1 wherein the termination structure is formed on a die containing a semiconductor device, wherein the semiconductor device is a superjunction device that includes alternating charge balanced first doped columns of first conductivity type and second doped columns of second conductivity type in an active cell region.

Assignees

Inventors

Classifications

  • Forming charge compensation regions, e.g. superjunctions · CPC title

  • H10D62/111Primary

    Multiple RESURF structures, e.g. double RESURF or 3D-RESURF structures · CPC title

  • comprising multiple field plate segments · CPC title

  • Field plates · CPC title

  • Electrodes comprising a Schottky barrier to a semiconductor · CPC title

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What does patent US8975720B2 cover?
A superjunction device and methods for layout design and fabrication of a superjunction device are disclosed. A layout of active cell column structures can be configured so that a charge due to first conductivity type dopants balances out charge due to second conductivity type dopants in a doped layer in an active cell region. A layout of end portions of the active cell column structures proxim…
Who is the assignee on this patent?
Guan Lingpeng, Bobde Madhur, Alpha & Omega Semiconductor
What technology area does this patent fall under?
Primary CPC classification H10D62/111. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).