Ultrasonic diagnostic device
US-2024389977-A1 · Nov 28, 2024 · US
US8975713B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8975713-B2 |
| Application number | US-201213976758-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 5, 2012 |
| Priority date | Jan 6, 2011 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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Official abstract text for this publication.
Disclosed is an ultrasonic probe comprising: CMUT cells ( 13 ) that mutually convert ultrasonic waves and electrical signals; a semiconductor substrate ( 15 ) that has a plurality of the CMUT cells ( 13 ) formed on the surface thereof; an acoustic lens ( 3 ) that is provided on the front face side of the CMUT cells ( 13 ); and a backing layer ( 5 ) that is provided on the rear face side of the semiconductor substrate ( 15 ). The backing layer ( 5 ) is formed by a first backing layer ( 27 ) that makes contact with the semiconductor substrate, and a second backing layer ( 29 ) that is provided on the rear face side of the backing layer ( 27 ). The acoustic impedance of the backing layer ( 27 ) is set based on the sheet thickness of the semiconductor substrate ( 15 ). The backing layer ( 29 ) is formed by attenuating material capable of attenuating ultrasonic waves transmitted through the backing layer ( 27 ). Multiple reflection of reflection echoes is suppressed by setting the acoustic impedance of the backing layer ( 29 ) to match the acoustic impedance of the backing layer ( 27 ).
Opening claim text (preview).
The invention claimed is: 1. An ultrasound probe comprising: a capacitive vibration element configured to mutually convert ultrasound and an electric signal; a semiconductor substrate including a plurality of the capacitive vibration elements formed on the surface thereof; an acoustic lens provided on a front face side of the capacitive vibration element; and a backing layer provided on a rear face side of the semiconductor substrate, wherein the backing layer includes a f…
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