Densely packed standard cells for integrated circuit products, and methods of making same

US8975712B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8975712-B2
Application numberUS-201313893524-A
CountryUS
Kind codeB2
Filing dateMay 14, 2013
Priority dateMay 14, 2013
Publication dateMar 10, 2015
Grant dateMar 10, 2015

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

One method disclosed herein includes forming first and second transistor devices in and above adjacent active regions that are separated by an isolation region, wherein the transistors comprise a source/drain region and a shared gate structure, forming a continuous conductive line that spans across the isolation region and contacts the source/drain regions of the transistors and etching the continuous conductive line to form separated first and second unitary conductive source/drain contact structures that contact the source/drain regions of the first and second transistors, respectively. A device disclosed herein includes a gate structure, source/drain regions, first and second unitary conductive source/drain contact structures, each of which contacts one of the source/drain regions, and first and second conductive vias that contact the first and second unitary conductive source/drain contact structures, respectively.

First claim

Opening claim text (preview).

What is claimed: 1. A method, comprising: forming first and second transistor devices in and above adjacent first and second active regions that are separated by an isolation region formed in a semiconductor substrate, said first and second transistors comprising at least one source/drain region and a shared gate structure: forming a continuous conductive line that spans across said isolation region, wherein said continuous conductive line contacts said at least one source/drain…

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Next steps

Free tools are coming soon. Tell us what you want to track and we'll notify you.

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US8975712B2 cover?
One method disclosed herein includes forming first and second transistor devices in and above adjacent active regions that are separated by an isolation region, wherein the transistors comprise a source/drain region and a shared gate structure, forming a continuous conductive line that spans across the isolation region and contacts the source/drain regions of the transistors and etching the con…
Who is the assignee on this patent?
Globalfoundries Inc
What technology area does this patent fall under?
Primary CPC classification H10D84/0193. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).