Nano transistors with source/drain having side contacts to 2-d material
US-2024379800-A1 · Nov 14, 2024 · US
US8975710B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8975710-B2 |
| Application number | US-201313966476-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 14, 2013 |
| Priority date | Sep 24, 2009 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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By covering ends of a field insulating film in a region where a MOS transistor having a relatively thin gate insulating film is formed with a relatively thick gate insulating film, a channel region of the MOS transistor having the relatively thin gate insulating film is set apart from an inversion-preventing diffusion layer formed under the field insulating film so as not to be influenced by film thickness fluctuation of the field insulating film, etching fluctuation of the relatively thick gate insulating film, and impurity concentration fluctuation at both sides of the channel due to the inversion-preventing diffusion layer.
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What is claimed is: 1. A semiconductor device comprising: a first MOS transistor having a relatively thick gate insulating film in contact with a substrate surface; and a second MOS transistor in an active region having a relatively thin gate insulating film in contact with a channel region and a gate electrode in contact with the relatively thin gate insulating film, the relatively thick gate insulating film having a thickness greater than a thickness of the relatively thin gat…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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