Thermoplastic elastomer compounds exhibiting retained clarity and improved surface structure
US-11952486-B2 · Apr 9, 2024 · US
Moulding compound for mouldings with high weather resistance
US8975337B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8975337-B2 |
| Application number | US-201113241776-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 23, 2011 |
| Priority date | May 5, 2004 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A molding compound comprises a copolymer (I)a), produced by polymerization of 90-100% by weight methylmethacrylate, styrene and malic acid anhydride, and optionally 0-10% by weight additional monomers which can be copolymerized with methylmethacrylate, a (co)polymer (II)b), produced by polymerization of 80-100% by weight methylmethacrylate and optionally 0-20% by weight additional monomers which can be copolymerized with methylmethacrylate, and has a solution viscosity in chloroform at 25° C. (ISO 1628 Part 6) of 50 to 55 ml/g, as well as c) optional conventional additives, auxiliary agents and/or fillers. The molding compound is characterized in that the copolymer (I) has a solution viscosity in chloroform at 25° C. (ISO 1628 Part) of 55 ml/g or less. Also disclosed are moldings produced by thermoplastic processing of the molding compound and their uses.
First claim
Opening claim text (preview).
What is claimed is: 1. A molding composition, comprising: a) a copolymer (I), containing from 90 to 100% by weight of polymerized methyl methacrylate, styrene, and maleic anhydride, and, optionally, from 0 to 10% by weight of other polymerized monomers copolymerizable with methyl methacrylate, b) a (co)polymer (II), containing from 96 to 99.5% by weight of polymerized methyl methacrylate and from 0.5 to 4% by weight of polymerized methyl acrylate, whose solution viscosity in chl…
Assignees
Inventors
Classifications
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US8975337B2 cover?
- A molding compound comprises a copolymer (I)a), produced by polymerization of 90-100% by weight methylmethacrylate, styrene and malic acid anhydride, and optionally 0-10% by weight additional monomers which can be copolymerized with methylmethacrylate, a (co)polymer (II)b), produced by polymerization of 80-100% by weight methylmethacrylate and optionally 0-20% by weight additional monomers whic…
- Who is the assignee on this patent?
- Hoess Werner, Wicker Michael, Schultes Klaus, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification C08L33/12. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).