Positive resist composition for immersion exposure and pattern forming method

Patent metadata

Field	Value
Publication number	US-8975002-B2
Application number	US-201313967402-A
Country	US
Kind code	B2
Filing date	Aug 15, 2013
Priority date	Sep 26, 2008
Publication date	Mar 10, 2015
Grant date	Mar 10, 2015

Abstract

A positive resist composition for immersion exposure includes the following (A) to (D): (A) a resin capable of decomposing by an action of an acid to increase a solubility of the resin in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a resin having at least either one of a fluorine atom and a silicon atom; and (D) a mixed solvent containing at least one kind of a solvent selected from the group consisting of solvents represented by any one of the following formulae (S1) to (S3) as defined in the specification, in which a total amount of the at least one kind of the solvent is from 3 to 20 mass % based on all solvents of the mixed solvent (D).

First claim

The invention claimed is:

1. A positive resist composition for immersion exposure, comprising the following (A) to (D):
(A) a resin capable of decomposing by an action of an acid to increase a solubility of the resin in an alkali developer;
(B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation;
(C) a resin having at least either one of a fluorine atom and a silicon atom; and
(D) a mixed solvent containing at least one kind of a solven…

Assignees

• Fujifilm Corp

Inventors

• Yamamoto Kei
• Saegusa Hiroshi

Classifications

• C09D133/26

  Chemistry & Metallurgy · mapped topic

• Y10S430/126

  Cross-Sectional Technologies · mapped topic

• C09D133/16 Primary

  Chemistry & Metallurgy · mapped topic

• G03F7/039 Primary

  Physics · mapped topic

• G03F7/0397

  Physics · mapped topic