Coil structure for generating plasma and semiconductor equipment
US-2024339296-A1 · Oct 10, 2024 · US
Synchronous embedded radio frequency pulsing for plasma etching
US8974684B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8974684-B2 |
| Application number | US-201213458191-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 27, 2012 |
| Priority date | Oct 28, 2011 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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Abstract
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Methods for etching a substrate are provided herein. In some embodiments, a method of etching a substrate may include generating a plasma by providing only a first RF signal having a first frequency and a first duty cycle; applying only a second RF signal to bias the plasma towards the substrate, wherein the second RF signal has the first frequency and a second duty cycle different than the first duty cycle; adjusting a phase variance between the first and second RF signals to control an ion energy distribution in the plasma; and etching the substrate with the plasma.
First claim
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The invention claimed is: 1. A method of etching a substrate, comprising: generating a plasma by providing only a first RF signal having a first frequency and a first duty cycle; applying only a second RF signal to bias the plasma towards the substrate, wherein the second RF signal has the first frequency and a second duty cycle different than the first duty cycle, and wherein an “on” portion of the second RF signal is entirely embedded with an “on” portion of the first RF signa…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H01J37/321Primary
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US8974684B2 cover?
- Methods for etching a substrate are provided herein. In some embodiments, a method of etching a substrate may include generating a plasma by providing only a first RF signal having a first frequency and a first duty cycle; applying only a second RF signal to bias the plasma towards the substrate, wherein the second RF signal has the first frequency and a second duty cycle different than the fir…
- Who is the assignee on this patent?
- Banna Samer, Agarwal Ankur, Applied Materials Inc
- What technology area does this patent fall under?
- Primary CPC classification H01J37/321. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).