Method of forming semiconductor devices
US-2024387980-A1 · Nov 21, 2024 · US
Manufacturing method of object having conductive line
US8973261B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8973261-B2 |
| Application number | US-201113244562-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 25, 2011 |
| Priority date | Nov 15, 2010 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A manufacturing method of an object having a conductive line includes the following steps. A hardening layer and a conductive line layer are formed in an in-mold roller (IMR) material in sequence. The conductive line layer is formed on a non-conductive substrate by an IMR process. A carrier sheet is then separated to expose the hardening layer. A connecting piece is formed on the hardening layer. The connecting piece runs through the hardening layer by a connection process, and the connecting piece is electrically connected to the conductive line layer. Therefore, an object structure having the conductive line is formed.
First claim
Opening claim text (preview).
What is claimed is: 1. A manufacturing method of an object having a conductive line, comprising the steps of: forming a hardening layer and an electrical pad partially exposed by the hardening layer at the same time by an insert molding process; disposing the hardening layer on a carrier sheet; forming a conductive line layer on the hardening layer by an in-mold roller (IMR) process, wherein the conductive line layer contacts the electrical pad, and wherein the carrier sheet…
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Classifications
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
- H01Q1/38Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8973261B2 cover?
- A manufacturing method of an object having a conductive line includes the following steps. A hardening layer and a conductive line layer are formed in an in-mold roller (IMR) material in sequence. The conductive line layer is formed on a non-conductive substrate by an IMR process. A carrier sheet is then separated to expose the hardening layer. A connecting piece is formed on the hardening laye…
- Who is the assignee on this patent?
- Chiang Cheng-Hung, Getac Technology Corp
- What technology area does this patent fall under?
- Primary CPC classification H01Q1/38. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).