Power module for vehicle and motor driving apparatus including the same
US-12528362-B2 · Jan 20, 2026 · US
Printed circuit board assembly
US8971047B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8971047-B2 |
| Application number | US-201213610145-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 11, 2012 |
| Priority date | Sep 28, 2011 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer.
First claim
Opening claim text (preview).
What is claimed is: 1. A printed circuit board assembly, comprising: a plurality of electronic components; a printed circuit board having the plurality of electronic components mounted thereon; a protection body configured to entirely cover the printed circuit board; and a flexible printed circuit board having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board outside the protection body, w…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8971047B2 cover?
- A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, a…
- Who is the assignee on this patent?
- Lee Yong Won, Park Tae Sang, Shin Hyo Young, and 4 more
- What technology area does this patent fall under?
- Primary CPC classification H05K7/1015. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).