Multi-purpose IO pads/bumps on semiconductor chips to maximize chip-to-chip data connectivity
US-12182051-B1 · Dec 31, 2024 · US
US8971044B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8971044-B2 |
| Application number | US-201213479032-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 23, 2012 |
| Priority date | Sep 26, 2007 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a first output unit configured to output a first phase; a second output unit disposed to be stacked on the first output unit and configured to output a second phase different from the first phase; and a controller configured to control the output units, wherein the output units further include a plurality of semiconductor elements and a wiring board having the semiconductor elements provided thereon, and the plurali…
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