Display having staggered display element arrangement
US-9196199-B2 · Nov 24, 2015 · US
Integrated passives and power amplifier
US8970516B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8970516-B2 |
| Application number | US-201113235158-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 16, 2011 |
| Priority date | Sep 23, 2010 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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- Title
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Abstract
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This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate. The power combiner circuit may include passive devices deposited on at least the first side of the first substrate. The integrated circuit may include a power amplifier circuit disposed on and configured for electrical connection with the power combiner circuit, to form a power amplification system. The conductive vias may include thermal vias configured for conducting heat from the power amplification system and/or interconnect vias configured for electrical connection between the power amplification system and a conductor on a second side of the first substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. An integrated device, comprising: a glass substrate having a first surface and a second surface that is substantially parallel to the first surface; at least one passive component on the first surface of the glass substrate; an integrated circuit die attached to the first surface of the glass substrate; conductive bonding pads on the second surface of the glass substrate; and a plurality of through-glass vias extending between the first surface and t…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8970516B2 cover?
- This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate.…
- Who is the assignee on this patent?
- Black Justin Phelps, Shenoy Ravindra V, Gousev Evgeni Petrovich, and 7 more
- What technology area does this patent fall under?
- Primary CPC classification G02B26/001. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).