Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Integrated circuit devices including electrode support structures and methods of fabricating the same
US8970039B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8970039-B2 |
| Application number | US-201213707394-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 6, 2012 |
| Priority date | Dec 7, 2011 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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Abstract
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A semiconductor device includes a plurality of electrode structures perpendicularly extending on a substrate, and at least one support unit extending between the plurality of electrode structures. The support unit includes at least one support layer including a noncrystalline metal oxide contacting a part of the plurality of electrode structures. Related devices and fabrication methods are also discussed.
First claim
Opening claim text (preview).
What is claimed is: 1. An integrated circuit device, comprising: a plurality of electrode structures on a substrate and protruding from a surface thereof; and a support unit comprising noncrystalline metal oxide spaced apart from the surface of the substrate, the support unit extending between ones of the electrode structures and contacting respective sidewalls thereof, wherein: the support unit comprises a heterogeneous material including a dopant that is configured to increa…
Assignees
Inventors
Classifications
- H10W70/635Primary
Electricity · mapped topic
Electricity · mapped topic
- H10D1/042Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8970039B2 cover?
- A semiconductor device includes a plurality of electrode structures perpendicularly extending on a substrate, and at least one support unit extending between the plurality of electrode structures. The support unit includes at least one support layer including a noncrystalline metal oxide contacting a part of the plurality of electrode structures. Related devices and fabrication methods are also…
- Who is the assignee on this patent?
- Samsung Electronics Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W70/635. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).