Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Semiconductor assemblies and structures
US8970034B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8970034-B2 |
| Application number | US-201213467465-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 9, 2012 |
| Priority date | May 9, 2012 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
Semiconductor assemblies, structures, and methods of fabrication are disclosed. A coating is formed on an electrically conductive pillar. The coating, which may be formed from at least one of a silane material and an organic solderability protectant material, may bond to a conductive material of the electrically conductive pillar and, optionally, to other metallic materials of the electrically conductive pillar. The coating may also bond to substrate passivation material, if present, or to otherwise-exposed surfaces of a substrate and a bond pad. The coating may be selectively formed on the conductive material. Material may not be removed from the coating after formation thereof and before reflow of the solder for die attach. The coating may isolate at least the conductive material from solder, inhibiting solder wicking or slumping along the conductive material and may enhance adhesion between the resulting bonded conductive element and an underfill material.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor assembly, comprising: a conductive element on a semiconductor substrate; solder electrically connecting the conductive element to a landing pad of another substrate; and a coating on the conductive element and substantially conforming to and fully covering an at least partially rounded exterior surface of the solder, the coating comprising at least one of metal-oxygen-silicon bonds, silicon-oxygen-silicon bonds, metal-sulfur bonds and sil…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US8970034B2 cover?
- Semiconductor assemblies, structures, and methods of fabrication are disclosed. A coating is formed on an electrically conductive pillar. The coating, which may be formed from at least one of a silane material and an organic solderability protectant material, may bond to a conductive material of the electrically conductive pillar and, optionally, to other metallic materials of the electrically …
- Who is the assignee on this patent?
- Gandhi Jaspreet S, Micron Technology Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W90/701. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).