Embedded heat spreader for package with multiple microelectronic elements and face-down connection

Patent metadata

Field	Value
Publication number	US-8970028-B2
Application number	US-201113339595-A
Country	US
Kind code	B2
Filing date	Dec 29, 2011
Priority date	Dec 29, 2011
Publication date	Mar 3, 2015
Grant date	Mar 3, 2015

Abstract

A microelectronic package includes a substrate, first and second microelectronic elements, and a heat spreader. The substrate has terminals thereon configured for electrical connection with a component external to the package. The first microelectronic element is adjacent the substrate and the second microelectronic element is at least partially overlying the first microelectronic element. The heat spreader is sheet-like, separates the first and second microelectronic elements, and includes an aperture. Connections extend through the aperture and electrically couple the second microelectronic element with the substrate.

First claim

The invention claimed is:

1. A microelectronic package, comprising:
a substrate having terminals thereon configured for electrical connection with a component external to the package;
a first microelectronic element having a first face adjacent to and facing the substrate, a second face opposite the first face, and an edge extending between the first and second faces;
a second microelectronic element having a face partially overlying and facing the second face of the first mic…

Assignees

• Zohni Wael
• Invensas Corp

Inventors

• Zohni Wael

Classifications

• H10W90/754

  Electricity · mapped topic

• H10W90/736

  Electricity · mapped topic

• H10W90/734

  Electricity · mapped topic

• H10W90/732

  Electricity · mapped topic

• H10W90/724

  Electricity · mapped topic