Semiconductor package having multiple substrates
US-2024395683-A1 · Nov 28, 2024 · US
Methods and structures for reducing stress on die assembly
US8970026B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8970026-B2 |
| Application number | US-201313764958-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 12, 2013 |
| Priority date | Feb 12, 2013 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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- Title
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- Abstract
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Abstract
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A first set of electrically conductive cladding is disposed on an inner section of one external side of a package substrate. The first set electrically conductive cladding is fabricated with a first solder compound. A second set of electrically conductive cladding is disposed on an outer section of the one external side of the substrate. The second set of electrically conductive cladding consists of a second solder compound. The outer section can be farther away from a center of the one external side of the substrate than the inner section. During a reflow process, the first and second solder compounds are configured to become completely molten when heated and the first solder compound solidifies at a higher temperature during cool down than the second solder compound.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device, comprising: a package substrate; a first set of electrically conductive cladding disposed on an inner section of one external side of the substrate, the first set electrically conductive cladding fabricated with a first solder compound; a second set of electrically conductive cladding disposed on an outer section of the one external side of the substrate, the second set of electrically conductive cladding consisting of a second so…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8970026B2 cover?
- A first set of electrically conductive cladding is disposed on an inner section of one external side of a package substrate. The first set electrically conductive cladding is fabricated with a first solder compound. A second set of electrically conductive cladding is disposed on an outer section of the one external side of the substrate. The second set of electrically conductive cladding consis…
- Who is the assignee on this patent?
- Leal George R, Higgins Iii Leo M, Pham Tim V, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10W70/66. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).