Semiconductor device and processes for making same
US-2024290783-A1 · Aug 29, 2024 · US
US8969993B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8969993-B2 |
| Application number | US-201313950698-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 25, 2013 |
| Priority date | Sep 6, 2012 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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A wide gap semiconductor device includes a substrate and a Schottky electrode. The substrate formed of a wide gap semiconductor material has a main face, and includes a first-conductivity-type region and a second-conductivity-type region. The Schottky electrode is arranged adjoining the main face of the substrate. At the substrate, there is foamed a trench having a side face continuous with the main face and a bottom continuous with the side face. The Schottky electrode adjoins the first-conductivity-type region at the side face of the trench and the main face, and adjoins the second-conductivity-type region at the bottom of the trench. The side face of the trench is inclined relative to the main face of the substrate.
Opening claim text (preview).
What is claimed is: 1. A wide gap semiconductor device comprising: a substrate formed of a wide gap semiconductor material, having a main face, and including a first-conductivity-type region and a second-conductivity-type region, and a Schottky electrode arranged adjoining said main face of said substrate, said substrate having a trench formed, said trench including a side face continuous with said main face, and a bottom continuous with said side face, said Schottky electro…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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