Systems and methods for fabricating cross-pillar superjunction structures for semiconductor power conversion devices
US-2024038836-A1 · Feb 1, 2024 · US
US8969953B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8969953-B2 |
| Application number | US-201314010333-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 26, 2013 |
| Priority date | Dec 21, 2009 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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Self-aligned charge balanced semiconductor devices and methods for forming such devices are disclosed. One or more planar gates are formed over a semiconductor substrate of a first conductivity type. One or more deep trenches are etched in the semiconductor self-aligned to the planar gates. The trenches are filled with a semiconductor material of a second conductivity type such that the deep trenches are charge balanced with the adjacent regions of the semiconductor substrate Source and body regions are formed by implanting dopants onto the filled trenches. This process can form self-aligned charge balanced devices with a cell pitch less than 12 microns.
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What is claimed is: 1. A method for forming a self-aligned charge balanced semiconductor device comprising: a) forming one or more planar gates over a semiconductor substrate of a first conductivity type; b) etching one or more deep trenches in the semiconductor substrate self-aligned to the planar gates; c) filling said deep trenches with a semiconductor material of a second conductivity type such that the deep trenches are charge balanced with the adjacent regions of the sem…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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