Rapid Thermal Processing System With Cooling System
US-2024379390-A1 · Nov 14, 2024 · US
US8969951B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8969951-B2 |
| Application number | US-201213470859-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 14, 2012 |
| Priority date | Jun 9, 2011 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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The generation of a variation in properties of vertical transistors is restrained. A vertical MOS transistor is formed in a semiconductor substrate. A first interlayer dielectric film and a first source wiring are formed over the front surface of the substrate. The first source wiring is formed over the first interlayer dielectric film, and is overlapped with the vertical MOS transistor as viewed in plan. Contacts are buried in the first interlayer dielectric film. Through the contacts, an n-type source layer of vertical MOS transistor is coupled with the first source wiring. Openings are made in the first source wiring.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a semiconductor substrate having at least two surfaces opposite to each other; a vertical transistor that is formed in the semiconductor substrate, and that has a gate electrode and a source layer at one surface side of the two surface sides of the semiconductor substrate and has a drain layer at the other surface side of the semiconductor substrate; a first interlayer dielectric film formed over the one surface of the…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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