Semiconductor device and fabrication method thereof
US-12159906-B2 · Dec 3, 2024 · US
US8969919B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8969919-B2 |
| Application number | US-201113312623-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 6, 2011 |
| Priority date | Sep 20, 2006 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A field-effect transistor includes a carrier transport layer made of nitride semiconductor, a gate electrode having first and second sidewall surfaces on first and second sides, respectively, an insulating film formed directly on the gate electrode to cover at least one of the first and second sidewall surfaces, first and second ohmic electrodes formed on the first and second sides, respectively, a passivation film including a first portion extending from the first ohmic electrode toward the gate electrode to cover a surface area between the first ohmic electrode and the gate electrode and a second portion extending from the second ohmic electrode toward the gate electrode to cover a surface area between the second ohmic electrode and the gate electrode, wherein the insulating film is in direct contact with at least the first and second passivation film portions, and has a composition different from that of the passivation film.
Opening claim text (preview).
What is claimed is: 1. A compound semiconductor device, comprising: a substrate; a semiconductor multilayer structure including a carrier transport layer made of nitride semiconductor formed above the substrate; a gate electrode, a source electrode, and a drain electrode formed above the semiconductor multilayer structure; an insulating film formed between the gate electrode and the source electrode and between the gate electrode and the drain electrode above the semiconduct…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Related publications grouped by family.
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Answers are generated from the same data shown on this page.