Semiconductor device and fabrication method thereof
US-12159906-B2 · Dec 3, 2024 · US
US8969918B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8969918-B2 |
| Application number | US-75694010-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 8, 2010 |
| Priority date | Apr 8, 2009 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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An enhancement mode GaN transistor having a gate pGaN structure having a thickness which avoids dielectric failure. In one embodiment, this thickness is in the range of 400 Å to 900 Å. In a preferred embodiment, the thickness is 600 Å.
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We claim: 1. An enhancement mode gallium nitride (GaN) transistor having a rated gate voltage of 5 volts, comprising: a p-type GaN gate structure with a thickness of 600 Å.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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