Optoelectronic component and method for producing same
US-12176444-B2 · Dec 24, 2024 · US
Uniform emission LED package
US8969908B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8969908-B2 |
| Application number | US-39821406-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 4, 2006 |
| Priority date | Apr 4, 2006 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.
First claim
Opening claim text (preview).
We claim: 1. An emitter package, comprising: a submount; a solid state emitter mounted to a surface of said submount, said submount comprising a first meniscus forming feature integral to said submount and around said solid state emitter; and an encapsulant matrix on said surface of said submount and covering said solid state emitter, said encapsulant matrix forming a dome-shape over said solid state emitter, the size and shape of said encapsulant matrix at least partially def…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10H20/8506Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8969908B2 cover?
- An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped…
- Who is the assignee on this patent?
- Negley Gerald, Leung Michael, Becerra Maryanne, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H10H20/8506. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).