Memory devices having signal routing structures at bonding interfaces
US-2024404976-A1 · Dec 5, 2024 · US
US8969887B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8969887-B2 |
| Application number | US-201313889143-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 7, 2013 |
| Priority date | May 7, 2012 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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A light emitting device includes: a support substrate; at least one light emitting laminate having a structure in which semiconductor layers are laminated and formed on the support substrate; a wall unit formed on the support substrate and surrounding the at least one light emitting laminate; and a wavelength conversion layer disposed above the at least one light emitting laminate.
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What is claimed is: 1. A light emitting device comprising: a support substrate; at least one light emitting laminate formed on the support substrate, the at least one light emitting laminate has a structure in which a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first and second conductivity-type semiconductor layers, are laminated; a wall unit formed on the support substrate and surroun…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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