Display apparatus
US-2024414942-A1 · Dec 12, 2024 · US
US8969867B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8969867-B2 |
| Application number | US-201313738443-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 10, 2013 |
| Priority date | Jan 18, 2012 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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The semiconductor device includes a transistor including an oxide semiconductor film having a channel formation region, a gate insulating film, and a gate electrode layer. In the transistor, the channel length is small (5 nm or more and less than 60 nm, preferably 10 nm or more and 40 nm or less), and the thickness of the gate insulating film is large (equivalent oxide thickness which is obtained by converting into a thickness of silicon oxide containing nitrogen is 5 nm or more and 50 nm or less, preferably 10 nm or more and 40 nm or less). Alternatively, the channel length is small (5 nm or more and less than 60 nm, preferably 10 nm or more and 40 nm or less), and the resistivity of the source region and the drain region is 1.9×10 −5 Ω·m or more and 4.8×10 −3 Ω·m or less.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: an oxide semiconductor film including a first region, a second region, and a channel formation region between the first region and the second region; a source electrode layer and a drain electrode layer electrically connected to the oxide semiconductor film; a gate electrode layer overlapping with the channel formation region; and a gate insulating film between the oxide semiconductor film and the gate electrode layer…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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