Wafer processing method
US-9209085-B2 · Dec 8, 2015 · US
Laser processing method
US8969752B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8969752-B2 |
| Application number | US-54852203-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 11, 2003 |
| Priority date | Mar 12, 2003 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1 a , irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1 a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1 a , attaching an expandable tape 23 to the rear face 21 of the wafer 1 a , and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1 a from the cutting start region 8 acting as a start point from each other.
First claim
Opening claim text (preview).
The invention claimed is: 1. A laser processing method for cutting a flat object to be processed including a substrate and a laminate part disposed on the substrate, the method comprising the steps of: attaching a protective film to a front face of the object on the laminate part side; irradiating a portion of a rear face of the object with laser light, after the step of attaching the protective film, wherein the portion of the rear face of the object comprises a laser light ent…
Assignees
Inventors
Classifications
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Cross-Sectional Technologies · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US8969752B2 cover?
- The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1 a , irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1 a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 d…
- Who is the assignee on this patent?
- Fukumitsu Kenshi, Fukuyo Fumitsugu, Uchiyama Naoki, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification B28D5/0011. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).