Circuit module
US-2024389235-A1 · Nov 21, 2024 · US
Printed circuit solder connections
US8969730B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8969730-B2 |
| Application number | US-201213587793-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 16, 2012 |
| Priority date | Aug 16, 2012 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces. A second printed circuit such as a flexible printed circuit may have openings. Solder connections may be formed in the openings to attach metal traces in the flexible printed circuit to the solder pads on the rigid printed circuit board. A ring of adhesive may surround the solder connections. The flexible printed circuit may be attached to the rigid printed circuit board using the ring of adhesive. An insulating tape may cover the solder connections. A conductive shielding layer with a conductive layer and a layer of conductive adhesive may overlap the solder joints. The conductive adhesive may connect the shielding layer to the metal traces on the rigid printed circuit board.
First claim
Opening claim text (preview).
What is claimed is: 1. Apparatus, comprising: a first printed circuit; a second printed circuit; solder connections between the first and second printed circuits; and an adhesive ring that that is interposed between the first and second printed circuits and that surrounds the solder connections, wherein the adhesive ring has a central opening, and wherein the second printed circuit has a recessed portion that extends into the central opening. 2. The app…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H05K1/14Primary
Electricity · mapped topic
- H05K1/0218Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8969730B2 cover?
- Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces. A second printed circuit such as a flexible printed circuit may have openings. Solder connections may be formed in the openings to attach metal traces in the flexible…
- Who is the assignee on this patent?
- Montevirgen Anthony S, Sanford Emery A, Lynch Stephen Brian, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H05K1/14. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).