Gate isolation features and methods of fabricating the same in semiconductor devices
US-2024379673-A1 · Nov 14, 2024 · US
US8969166B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8969166-B2 |
| Application number | US-201414156785-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 16, 2014 |
| Priority date | Apr 6, 2011 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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An apparatus for selectively improving integrated circuit performance is provided. In an example, an integrated circuit is fabricated according to an integrated circuit layout. A critical portion of the integrated circuit layout determines a speed of the integrated circuit, where at least a part of the critical portion includes at least one of a halo implant region, lightly doped drain (LDD) implant region, and source drain extension (SDE) implant region. A marker layer comprises the part of the critical portion that includes the at least one of the halo implant region, the lightly doped drain (LDD) implant region, and the source drain extension (SDE) implant region, and includes at least one transistor formed therefrom.
Opening claim text (preview).
What is claimed is: 1. A method for selectively improving integrated circuit performance, comprising: defining a critical portion of an integrated circuit layout that determines the speed of the integrated circuit; identifying at least a part of the critical portion that includes a halo implant region; performing a speed push flow process to increase performance of the part of the critical portion that includes the halo implant region; wherein the speed push flow process fur…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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