Electroplating processor with geometric electrolyte flow path

US8968533B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8968533-B2
Application numberUS-201213468273-A
CountryUS
Kind codeB2
Filing dateMay 10, 2012
Priority dateMay 10, 2012
Publication dateMar 3, 2015
Grant dateMar 3, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electroplating processor, comprising: a vessel; an electrode plate in the vessel with a continuous flow path formed in a channel in the electrode plate and extending between an inlet and an outlet on the electrode plate, the continuous flow path having rings formed into a coil; a membrane on top of the electrode plate, with the membrane covering the continuous flow path formed in the channel; and a membrane plate attached to the electrode plat…

Assignees

Inventors

Classifications

  • Chemistry & Metallurgy · mapped topic

  • C25D17/02Primary

    Chemistry & Metallurgy · mapped topic

  • Chemistry & Metallurgy · mapped topic

  • C25D17/12Primary

    Chemistry & Metallurgy · mapped topic

  • C25D17/001Primary

    Chemistry & Metallurgy · mapped topic

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What does patent US8968533B2 cover?
An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the…
Who is the assignee on this patent?
Harris Randy A, Woodruff Daniel J, Turner Jeffrey I, and 3 more
What technology area does this patent fall under?
Primary CPC classification C25D17/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).