Fluid separation for an anodizing process
US-2024247392-A1 · Jul 25, 2024 · US
US8968533B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8968533-B2 |
| Application number | US-201213468273-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 10, 2012 |
| Priority date | May 10, 2012 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.
Opening claim text (preview).
The invention claimed is: 1. An electroplating processor, comprising: a vessel; an electrode plate in the vessel with a continuous flow path formed in a channel in the electrode plate and extending between an inlet and an outlet on the electrode plate, the continuous flow path having rings formed into a coil; a membrane on top of the electrode plate, with the membrane covering the continuous flow path formed in the channel; and a membrane plate attached to the electrode plat…
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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