Press-forming device, press-forming method, computer program/software arrangement and storage medium

US8965554B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8965554-B2
Application numberUS-201113050691-A
CountryUS
Kind codeB2
Filing dateMar 17, 2011
Priority dateNov 11, 2003
Publication dateFeb 24, 2015
Grant dateFeb 24, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Exemplary embodiments of a press-forming device, press-forming method, computer program/software arrangement and storage medium can be provided. The exemplary press-forming device can include a material characteristic input configured to input material characteristics. A state variable detector can be configured to measure a state variable comprising a metal mold distortion amount. A processing condition computer arrangement can be configured to determine from a first moment to a second moment at least one particular processing condition. Further, a processing condition controller can be configured to control the at least one processing condition from processing conditions.

First claim

Opening claim text (preview).

What is claimed is: 1. A non-transitory computer-readable medium having instructions stored thereon, such that when the instructions are read and executed by a processor, the processor is configured to perform the steps of: causing at least one of: providing at least one first characteristic from material characteristics comprising a thickness of the at least one portion of the material, a yield strength of the at least one portion of the material, about 0.2% proof stress, a tensile strength of the at least one portion of the material, an elongation of the at least one portion of the material, n value of the at least one portion of the material, r value of the at least one portion of the material, a stress-strain relation equation for the at least one portion of the material, a hardness of the at least one portion of the material, temperature, a surface roughness of the at least one portion of the material, a friction coefficient of the at least one portion of the material or a lubricant film thickness of the at least one portion of the material, or measuring at least one second characteristic of the material characteristics before the at least one portion of the material is form; measuring a state variable comprising a metal mold distortion amount, or the state variable and at least one of state variables comprising a punch reaction, a metal mold temperature, a work piece deformation amount or a work piece temperature during the formation of the at least one portion of the material; determining from a first moment to a second moment of at least one particular processing condition from at least one of a forming speed of the at least one portion of the material, a blank holding force or a metal mold temperature as a function of at least two of the at least one first characteristic, the at least one second characteristic or the at least one of the state variables, wherein said determining is performed using (i) a first influence function matrix for indicating a relation between a material characteristic of the material and a correction amount of the at least one particular processing condition, and (ii) a second influence function matrix for indicating a relation between a state variable and the correction amount of the at least one particular processing condition; and controlling the at least one processing condition from processing conditions comprising at least one of a punch movement speed, a die movement speed, a metal mold temperature or a blank holding force based on the at least one processing condition, correcting an initialization value C0(i) of the at least one processing condition using: C 0( i )(after correction)= C 0( i )(initialization value)*(1+Σ( T 1( i,j )*( P ( j )/ P 0( j )−1))) ( i= 1 −L,j= 1 −M ), where T1(i,j) is an influence function matrix which indicates a relation between a deviation of the material characteristic of a material from a reference value thereof and an amount of correction of the at least one processing condition, where P(j) are material characteristic values, where P0(j) are reference values for respective material characteristics, where L is a number of processing condition set values, and where M is a number of the material characteristic values, and correcting (iii) correct the at least one processing condition using: C ( i )= C 0( i )*(1+Σ( T 2( i,k )*( S ( k )/ S 0( k )−1))),( i= 1 −L,k= 1 −N ), where C(i) (i=1−L) are correction values for respective processing conditions, where T2(i,k) (i=1−L, k=1−N) is an influence function matrix which indicates a relation between a deviation of a measured state variable to a reference value and a correction amount of the at least one processing condition, where S(k) (k=1−N) is the state variable, where S0(k) (k=1−N) is a reference state variable, and where N is a number of the state variable. 2. A method comprising: controlling the at least one processing condition from processing conditions comprising at least one of a punch movement speed, a die movement speed, a metal mold temperature or a blank holding force based on the at least one processing condition; correcting an initialization value C0(i) of the at least one processing condition using: C 0( i )(after correction)= C 0( i )(initialization value)*(1+Σ( T 1( i,j )*( P ( j )/ P 0( j )−1))) ( i= 1 −L,j= 1 −M ), where T1(i,j) is an influence function matrix which indicates a relation between a deviation of the material characteristic of a material from a reference value thereof and an amount of correction of the at least one processing condition, where P(j) are material characteristic values, where P0(j) are reference values for respective material characteristics, where L is a number of processing condition set values, and where M is a number of the material characteristic values; and correcting the at least one processing condition using: C ( i )= C 0( i )*(1+Σ( T 2( i,k )*( S ( k )/ S 0( k )−1))),( i= 1 −L,k= 1 −N ), where C(i) (i=1−L) are correction values for respective processing conditions, where T2(i,k) (i=1−L, k=1−N) is an influence function matrix which indicates a relation between a deviation of a measured state variable to a reference value and a correction amount of the at least one processing condition, where S(k) (k=1−N) is the state variable, where S0(k) (k=1−N) is a reference state variable, and where N is a number of the state variable. 3. A non-transitory computer-readable medium having instructions stored thereon, said instructions are read and executed by a processor for causing the processor to perform the method according to claim 2 .

Assignees

Inventors

Classifications

  • B21D22/20Primary

    Deep-drawing (special deep-drawing arrangements in, or in connection with, presses B21D24/00) · CPC title

  • Material type of each layer to be drilled, to be joined · CPC title

  • As a function of, regulate feed as function of material, tool · CPC title

  • Devices controlling or operating blank holders independently, or in conjunction with dies · CPC title

  • with devices for holding the edge of the blanks (B21D22/24 - B21D22/30 take precedence; shaping over a die without external former B21D11/02) · CPC title

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What does patent US8965554B2 cover?
Exemplary embodiments of a press-forming device, press-forming method, computer program/software arrangement and storage medium can be provided. The exemplary press-forming device can include a material characteristic input configured to input material characteristics. A state variable detector can be configured to measure a state variable comprising a metal mold distortion amount. A processing…
Who is the assignee on this patent?
Suzuki Noriyuki, Uenishi Akihiro, Kuriyama Yukihisa, and 5 more
What technology area does this patent fall under?
Primary CPC classification B21D22/20. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).