Wiring board having a reinforcing member with capacitors incorporated therein

Patent metadata

Field	Value
Publication number	US-8964403-B2
Application number	US-201113294763-A
Country	US
Kind code	B2
Filing date	Nov 11, 2011
Priority date	Nov 17, 2010
Publication date	Feb 24, 2015
Grant date	Feb 24, 2015

Abstract

There is provided a wiring board including a multilayer substrate and a reinforcing member. The multilayer substrate has a first main substrate surface formed with a chip mounting area to which an electronic chip is mounted and a second main substrate surface opposed to the first main substrate surface. The reinforcing member is fixed to either an area of the first main substrate surface other than the chip mounting area or the second main substrate surface and has a body predominantly formed of ceramic material and incorporating therein at least one capacitor.

First claim

What is claimed is:

1. A wiring board, comprising;
a multilayer substrate having a first main substrate surface and a second main substrate surface opposed to the first main substrate surface, the first main substrate surface including a chip mounting area to which an electronic chip is mounted; and
a reinforcing member comprising a body and a plurality of capacitors incorporated inside the body, the body being predominantly formed of ceramic material and fixed to an area of the…

Assignees

• Ueno Seigo
• Ngk Spark Plug Co

Inventors

• Ueno Seigo

Classifications

• H10W90/724

  Electricity · mapped topic

• H10W90/401

  Electricity · mapped topic

• H10W42/121

  Electricity · mapped topic

• H10W76/40

  Electricity · mapped topic

• H05K1/181

  Electricity · mapped topic