Magnetic detection device and semiconductor integrated circuit for amplifying magnetic detection signal
US-11860245-B2 · Jan 2, 2024 · US
Magnetic sensor
US8963545B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963545-B2 |
| Application number | US-201013321740-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 29, 2010 |
| Priority date | Jun 30, 2009 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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Abstract
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The present invention relates to a magnetic sensor that provides the sensitivity adjustment on a wafer and that has a superior mass productiveness and a small characteristic variation. The magnetic sensor includes a magnetic sensitive portion provided on a substrate that is made of a compound semiconductor and that has a cross-shaped pattern. This magnetic sensitive portion includes input terminals and output terminals. At least one of input terminals of the input terminal is series-connected to a trimming portion having a compound semiconductor via a connection electrode. By performing laser trimming on the trimming portion series-connected via the connection electrode to the magnetic sensitive portion while performing a wafer probing (electric test), the adjustment of the constant voltage sensitivity is provided.
First claim
Opening claim text (preview).
The invention claimed is: 1. A magnetic sensor including a magnetic sensitive portion composed of a compound semiconductor provided in a substrate comprising: the magnetic sensitive portion that has a predetermined-shaped pattern; and the magnetic sensitive portion that includes an input terminal pair and an output terminal pair; wherein at least one of input terminals of the input terminal pair is series-connected to a trimming portion having the compound semiconductor via a…
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Frequently asked questions
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- What does patent US8963545B2 cover?
- The present invention relates to a magnetic sensor that provides the sensitivity adjustment on a wafer and that has a superior mass productiveness and a small characteristic variation. The magnetic sensor includes a magnetic sensitive portion provided on a substrate that is made of a compound semiconductor and that has a cross-shaped pattern. This magnetic sensitive portion includes input termi…
- Who is the assignee on this patent?
- Watanabe Satomi, Asahi Kasei Microdevices Corp
- What technology area does this patent fall under?
- Primary CPC classification G01R33/07. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).