Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Apparatus, system, and method for wireless connection in integrated circuit packages
US8963333B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963333-B2 |
| Application number | US-201313970053-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 19, 2013 |
| Priority date | Jun 29, 2006 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
First claim
Opening claim text (preview).
What is claimed is: 1. An apparatus comprising: a support including a support surface and a support bond pad on the support surface; a first die including a first die surface and a first die bond pad on the first die surface, wherein the first die is disposed on the support; a connection coupled to the first die bond pad and the support bond pad; a second die arranged in a stack with the first die, the second die including a second die surface and a second die bond pad on th…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US8963333B2 cover?
- Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond …
- Who is the assignee on this patent?
- Intel Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W70/60. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).