Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device
US8963308B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963308-B2 |
| Application number | US-201414188417-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 24, 2014 |
| Priority date | Oct 25, 2011 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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Abstract
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Semiconductor packages are provided. The semiconductor packages may include an upper package including a plurality of upper semiconductor devices connected to an upper package substrate. The semiconductor packages may also include a lower package including a lower semiconductor device connected to a lower package substrate. The upper and lower packages may be connected to each other.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor package comprising: a package substrate comprising first through fourth outer sides; a lower semiconductor device that is on the package substrate and that comprises first through fourth inner sides corresponding respectively to the first through fourth outer sides; first through fourth upper semiconductor devices on the lower semiconductor device at positions corresponding to the first through fourth inner sides, respectively; and firs…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8963308B2 cover?
- Semiconductor packages are provided. The semiconductor packages may include an upper package including a plurality of upper semiconductor devices connected to an upper package substrate. The semiconductor packages may also include a lower package including a lower semiconductor device connected to a lower package substrate. The upper and lower packages may be connected to each other.
- Who is the assignee on this patent?
- Kwon Heung-Kyu, Kim Young-Bae, Lee Yun-Hee, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10W40/10. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).