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Semiconductor package and fabrication method thereof
US8963299B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963299-B2 |
| Application number | US-201213660277-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 25, 2012 |
| Priority date | Jun 4, 2012 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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Abstract
Official abstract text for this publication.
A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side surfaces of the semiconductor element and extending to the conductive pad; and an electronic element disposed on the conductive adhesive. The conductive adhesive and the conductive pad form a shielding structure so as to prevent electromagnetic interference from occurring between the semiconductor element and the electronic element.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor package, comprising: a substrate having a plurality of first conductive pads and at least a second conductive pad; at least a semiconductor element disposed on the substrate and electrically connected to the first conductive pads; a conductive adhesive coated on and being in direct contact with a side surface of the semiconductor element and extending to the second conductive pad of the substrate so as to form a shielding structure togeth…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8963299B2 cover?
- A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side surfaces of the semiconductor element and extending to the conductive pad; and an electronic element disposed on the conductive adhesive. The conductive adhesive and the conductive pad form a shielding struc…
- Who is the assignee on this patent?
- Siliconware Precision Industries Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W72/013. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).