Semiconductor die, semiconductor package and substrate dicing method
US-2024421000-A1 · Dec 19, 2024 · US
US8963291B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963291-B2 |
| Application number | US-201113112738-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 20, 2011 |
| Priority date | Sep 10, 2004 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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A semiconductor device including a low dielectric constant film of which the relative dielectric constant is less than 3.5, is provided with one or more seal rings that are moisture blocking walls forming a closed loop in a plan view, and where at least one of the seal rings includes a seal ring protrusion portion in inward protruding form in the vicinity of a chip corner.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device, comprising a low dielectric constant film having a relative dielectric constant less than 3.5, and a seal ring which is a moisture blocking wall forming a closed loop in a plan view, wherein said seal ring includes a seal ring protrusion portion in inward protruding form in a vicinity of a corner of a chip, wherein a passivation film covers said low dielectric constant film and the seal ring, and has a opening penetrating the passiv…
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