Semiconductor device and method for forming the same

US8963252B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8963252-B2
Application numberUS-201213618127-A
CountryUS
Kind codeB2
Filing dateSep 14, 2012
Priority dateNov 7, 2011
Publication dateFeb 24, 2015
Grant dateFeb 24, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Semiconductor devices and methods of forming the same are provided. The semiconductor device may include a semiconductor element disposed on a substrate and including an insulating layer and a gate electrode, a doped region having a first conductivity-type on the substrate, a conductive interconnection electrically connected to the gate electrode, and a first contact plug having a second conductivity-type and electrically connecting the conductive interconnection and the doped region to each other and constituting a Zener diode by junction with the doped region.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor device comprising: a semiconductor element on a substrate, the semiconductor element including an insulating layer and a gate electrode; a doped region having a first conductivity-type on the substrate; a conductive interconnection electrically connected to the gate electrode; and a first contact plug having a second conductivity-type, the first contact plug electrically connecting the conductive interconnection and the doped region to each other and constituting a Zener diode at a junction with the doped region. 2. The semiconductor device as set forth in claim 1 , wherein the first conductivity-type is high-concentration P-type, and the second conductivity-type is high-concentration N-type. 3. The semiconductor device as set forth in claim 1 , further comprising: a second contact plug connecting the gate electrode and the conductive interconnection to each other. 4. The semiconductor device as set forth in claim 3 , wherein the first and second contact plugs are formed in a same process for forming a plug. 5. The semiconductor device as set forth in claim 1 , wherein the doped region is in a first region, the first region being apart from a second region in which the semiconductor element is formed. 6. The semiconductor device as set forth in claim 1 , wherein the doped region has substantially a same concentration as a source/drain of the semiconductor element. 7. The semiconductor device as set forth in claim 1 , wherein doping concentrations of the first contact plug and the doped region are such that a breakdown voltage of the Zener diode is in the range of about 3.5 to 10 volt. 8. The semiconductor device as set forth in claim 1 , wherein a junction surface of the Zener diode is determined by a cross-sectional area of the first contact plug. 9. A semiconductor device comprising: a semiconductor element on a substrate; a doped region on the substrate, the doped region having a first conductivity-type; and a doped element projecting from the substrate, the doped element having a second conductivity-type, and the doped element contacting the doped region to form a Zener diode and electrically connected to the semiconductor element, wherein the doped element is connected to a gate electrode of the semiconductor element. 10. The semiconductor device as set forth in claim 9 , wherein the first conductivity-type is P-type, and the second conductivity-type is N-type. 11. The semiconductor device as set forth in claim 9 , wherein doping concentrations of the doped element and the doped region are such that a breakdown voltage of the Zener diode is in the range of about 3.5 to 10 volt. 12. The semiconductor device as set forth in claim 9 , further comprising: a conductive line between the semiconductor element and the doped element. 13. The semiconductor device as set forth in claim 12 , wherein the conductive line includes at least one metal line. 14. The semiconductor device as set forth in claim 9 , wherein the doped element is a contact plug. 15. The semiconductor device as set forth in claim 9 , wherein the first conductivity-type is one of high-concentration P-type and high-concentration N-type, and the second conductivity-type is the other one of high-concentration P-type and high-concentration N-type.

Assignees

Inventors

Classifications

  • having non-uniform gate electrodes, e.g. gate conductors having varying doping · CPC title

  • having rounded corners · CPC title

  • Vertical DMOS [VDMOS] FETs · CPC title

  • of vertical DMOS [VDMOS] FETs · CPC title

  • Combinations of field-effect devices and one or more diodes, capacitors or resistors · CPC title

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What does patent US8963252B2 cover?
Semiconductor devices and methods of forming the same are provided. The semiconductor device may include a semiconductor element disposed on a substrate and including an insulating layer and a gate electrode, a doped region having a first conductivity-type on the substrate, a conductive interconnection electrically connected to the gate electrode, and a first contact plug having a second conduc…
Who is the assignee on this patent?
Kim Moojin, Lee Jeongyun, Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10D89/611. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).