Method of manufacturing silicon carbide semiconductor power device
US-2024021478-A1 · Jan 18, 2024 · US
US8963244B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963244-B2 |
| Application number | US-201313894751-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 15, 2013 |
| Priority date | May 15, 2013 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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A semiconductor device includes a transistor. The transistor includes a source region, a drain region, a body region, a drift zone, and a gate electrode adjacent to the body region. The body region, the drift zone, the source region and the drain region are disposed in a first semiconductor layer having a first main surface. The body region and the drift zone are disposed along a first direction between the source region and the drain region, the first direction being parallel to the first main surface. Trenches are disposed in the first semiconductor layer, the trenches extending in the first direction. The transistor further includes a drift control region arranged adjacent to the drift zone. The drift control region and the gate electrode are disposed in the trenches.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device, comprising: a transistor, the transistor comprising a body region, a drift zone, a source region and a drain region in a first semiconductor layer having a first main surface, the body region and the drift zone being disposed between the source region and the drain region, the source region, the body region, the drift zone and the drain region being disposed along a first direction, the first direction being parallel to the first main…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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