Display Device
US-2024290249-A1 · Aug 29, 2024 · US
Semiconductor light emitting device
US8963192B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963192-B2 |
| Application number | US-201213406329-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 27, 2012 |
| Priority date | Aug 5, 2011 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
According to one embodiment, a semiconductor light emitting device having a base, a mounting material and a chip of a semiconductor light emitting element is provided. The mounting material is provided on the base. The chip of the semiconductor light emitting element is fixed onto the base via the mounting material. The chip of the semiconductor light emitting element is provided with a sapphire substrate, an active region, a light shielding portion and anode and cathode electrodes for supplying an electric power to the active region. The active region is provided on the sapphire substrate and has a light emitting layer for emitting light by supplying electric power. The light shielding portion is formed on the sapphire substrate on the side of the mounting material. The light shielding portion prevents the mounting material from being irradiated with the light produced in the light emitting layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor light emitting device comprising: a lead; a mounting material provided on the lead; a semiconductor light emitting element fixed onto the lead via the mounting material; and a fluorescent material disposed on the semiconductor light emitting element such that the semiconductor light emitting element is between the fluorescent material and the mounting material, the semiconductor light emitting element including: a sapphire substrate;…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8963192B2 cover?
- According to one embodiment, a semiconductor light emitting device having a base, a mounting material and a chip of a semiconductor light emitting element is provided. The mounting material is provided on the base. The chip of the semiconductor light emitting element is fixed onto the base via the mounting material. The chip of the semiconductor light emitting element is provided with a sapphir…
- Who is the assignee on this patent?
- Hosokawa Tadaaki, Itonaga Shuji, Toshiba Kk
- What technology area does this patent fall under?
- Primary CPC classification H10H20/814. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).