Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US8963183B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963183-B2 |
| Application number | US-201313760637-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 6, 2013 |
| Priority date | Jul 28, 2010 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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A light-emitting diode (LED) according to an exemplary embodiment includes a light-emitting structure arranged on a first surface of a substrate, the light-emitting structure including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. A first distributed Bragg reflector is arranged on a second surface of the substrate opposite to the first surface, the first distributed Bragg reflector to reflect light emitted from the light-emitting structure. The first distributed Bragg reflector has a reflectivity of at least 90% with respect to blue, green, and red light.
Opening claim text (preview).
What is claimed is: 1. A light-emitting diode (LED), comprising: a substrate having a first surface and an opposing second surface; a light-emitting structure disposed on the first surface of the substrate, the light-emitting structure comprising: a first conductivity-type semiconductor layer; a second conductivity-type semiconductor layer; and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor l…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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