Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US8963181B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963181-B2 |
| Application number | US-201213711662-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 12, 2012 |
| Priority date | Sep 21, 2007 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum.
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What is claimed is: 1. A radiation-emitting component comprising: a semiconductor layer stack having an active region that emits electromagnetic radiation; and a covering element having a surface, wherein an absorbent or reflective layer is arranged on the surface in a first section of the covering element and in a second section of the covering element the surface is free of the absorbent or reflective layer; wherein, on one of the surfaces of the second section of the cover…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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