Semiconductor device and fabrication method thereof
US-12159906-B2 · Dec 3, 2024 · US
US8963151B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963151-B2 |
| Application number | US-201113226108-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 6, 2011 |
| Priority date | May 3, 2011 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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A high efficiency HFET may include a substrate, a semi-insulating gallium nitride (GaN) layer formed on the substrate, an aluminum gallium nitride (AlGaN) layer formed on the GaN layer, and a silicon carbide (Si x C 1-x ) functional layer formed on the AlGaN layer.
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What is claimed is: 1. A heterostructure field effect transistor (HFET) comprising: a substrate; a semi-insulating gallium nitride (GaN) layer formed on the substrate; an aluminum gallium nitride (AlGaN) layer formed on the GaN layer; and a silicon carbide (Si x C 1-x ) functional layer formed on the AlGaN layer, wherein x of the Si x C 1-x functional layer has a value in a range of 0.6<x<1, and wherein the Si x C 1-x functional layer is disposed to cover an entire surface of the…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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