Electrode of electrostatic lens and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-8963099-B2
Application number	US-201313862728-A
Country	US
Kind code	B2
Filing date	Apr 15, 2013
Priority date	May 17, 2012
Publication date	Feb 24, 2015
Grant date	Feb 24, 2015

Abstract

An electrode to be used for an electrostatic lens, wherein the electrode at least includes: a first substrate having a first through-hole and a second substrate having a second through-hole; the first substrate having a thickness smaller than the second substrate; the first through-hole having a diameter smaller than the second through-hole; the second substrate having a specific resistance smaller than the first substrate, wherein the first substrate and the second substrate are superimposed so that the first through-hole and the second through-hole are aligned relative to each other. Notching taking place near any of the through-holes in a dry etching process can be reduced, and thus, the through-holes can be formed accurately.

First claim

What is claimed is:

1. A method of manufacturing an electrode to be used for an electrostatic lens, the method comprising:
a step of preparing a first substrate having a first through-hole;
a step of forming a second through-hole in an original substrate, which is to be processed into a second substrate, from a side of a first surface of the original substrate toward a second surface opposite to the first surface, wherein the second through-hole has a diameter greater than the first through-hole, and the second substrate has a specific resistance smaller than the first substrate; and
a step of superimposing the first substrate and the second substrate by way of aligning the first through-hole and the second through-hole relative to each other and then laying the first substrate on the second surface of the second substrate, after the step of forming the second through-hole.

2. The method according to claim 1 , wherein the first substrate has a thickness smaller than the second substrate.

3. The method according to claim 1 , wherein the step of forming the second through-hole comprises:
a step of forming a hole in the original substrate from the side of the first surface of the original substrate, the hole being not a through-hole getting to the second surface opposite to the first surface;
a step of filling the hole with an infill by means of electroplating;
a step of thinning the original substrate filled with the infill from a side of the second surface thereof; and
a step of removing the infill from the thinned original substrate.

4. The method according to claim 1 , wherein the first through-hole and/or the second through-hole is formed without using an etching stop layer.

Assignees

• Canon Kk

Inventors

• Yamada Shuji

Classifications

• H01J3/18 Primary

  Electrostatic lenses · CPC title

• H01J2237/032

  Mounting or supporting · CPC title

• H01J37/317

  for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation (H01J37/36 takes precedence) · CPC title

• H01J37/12

  electrostatic · CPC title

• H01J9/14

  of non-emitting electrodes · CPC title