Metal base substrate, power module, and method for manufacturing metal base substrate
US-2015332982-A1 · Nov 19, 2015 · US
Manufacturing method of circuit board
US8963019B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963019-B2 |
| Application number | US-201213570251-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 9, 2012 |
| Priority date | Jun 11, 2012 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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- Title
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Abstract
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A circuit board and a manufacturing method thereof are provided. According to the method, a dielectric layer is formed on a dielectric substrate, and the dielectric layer contains active particles. A surface treatment is performed on a surface of the dielectric first conductive layer is formed on the activated surface of the dielectric layer. A conductive via is formed in the dielectric substrate and the dielectric layer. A patterned mask layer is formed on the first conductive layer, in which the patterned mask layer exposes the conductive via and a part of the first conductive layer. A second conductive layer is formed on the first conductive layer and conductive via exposed by the patterned mask layer. The patterned mask layer and the first conductive layer below the patterned mask layer are removed.
First claim
Opening claim text (preview).
What is claimed is: 1. A manufacturing method of circuit board, comprising: providing a dielectric substrate; forming a dielectric layer on the dielectric substrate, wherein the dielectric layer contains a plurality of active particles therein; performing a surface treatment on a surface of the dielectric layer so as to activate the active particles at the surface of the dielectric layer; forming a first conductive layer on the activated surface of the dielectric layer; fo…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8963019B2 cover?
- A circuit board and a manufacturing method thereof are provided. According to the method, a dielectric layer is formed on a dielectric substrate, and the dielectric layer contains active particles. A surface treatment is performed on a surface of the dielectric first conductive layer is formed on the activated surface of the dielectric layer. A conductive via is formed in the dielectric substra…
- Who is the assignee on this patent?
- Yu Cheng-Po, Huang Shang-Feng, Lee Chang-Ming, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H05K3/381. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).