Inflexible voltage reference circuit card, and method for manufacturing an inflexible voltage reference circuit card
US-2024215166-A1 · Jun 27, 2024 · US
Method and apparatus for supporting a computer chip on a printed circuit board assembly
US8962388B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8962388-B2 |
| Application number | US-201113292630-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 9, 2011 |
| Priority date | Nov 30, 2006 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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Abstract
Official abstract text for this publication.
A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.
First claim
Opening claim text (preview).
What is claimed is: 1. A method comprising: providing a printed circuit board, the printed circuit board defining a trench, wherein the trench separates a first portion of the printed circuit board from a second portion of the printed circuit board; positioning a first chip on the first portion of the printed circuit board such that no part of the first chip is on the second portion of the circuit board, wherein the first chip has a plurality of solder bumps outside of a central…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
- H05K1/0271Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8962388B2 cover?
- A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed …
- Who is the assignee on this patent?
- Nagar Mohan R, Liu Kuo-Chuan, Ahmad Mudasir, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0271. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).