Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US8962362B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8962362-B2 |
| Application number | US-200913503582-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 5, 2009 |
| Priority date | Nov 5, 2009 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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A method for manufacturing vertically structured Group III nitride semiconductor LED chips includes a step of forming a light emitting laminate on a growth substrate; a step of forming a plurality of separate light emitting structures by partially removing the light emitting laminate to partially expose the growth substrate; a step of forming a conductive support on the plurality of light emitting structures; a step of lifting off the growth substrate from the plurality of light emitting structures; and a step of cutting the conductive support thereby singulating a plurality of LED chips each having the light emitting structure. The step of partially removing the light emitting laminate is performed such that each of the plurality of light emitting structures has a top view shape of a circle or a 4n-gon (“n” is a positive integer) having rounded corners.
Opening claim text (preview).
The invention claimed is: 1. A method for manufacturing vertically structured Group III nitride semiconductor LED chips, comprising: a light emitting laminate formation step of forming a light emitting laminate by sequentially stacking a first conductivity type Group III nitride semiconductor layer, a light emitting layer, and a second conductivity type Group III nitride semiconductor layer on a growth substrate, the second conductivity type being different from the first conducti…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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