High aspect ratio adhesive structure and a method of forming the same

US8961855B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8961855-B2
Application numberUS-201013202090-A
CountryUS
Kind codeB2
Filing dateFeb 12, 2010
Priority dateFeb 17, 2009
Publication dateFeb 24, 2015
Grant dateFeb 24, 2015

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Abstract

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A method of forming a high aspect ratio adhesive structure, the method comprising fabricating a porous template comprising at least a first tier and a second tier; introducing a softened polymer into the template; and separating the polymer from the template.

First claim

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What is claimed is: 1. A method of forming a high aspect ratio adhesive structure, the method comprising: fabricating a porous template to have a first, second, and third plurality of pores created by successive anodization forming first, second, and third template tiers respectively, a plurality of the second plurality of pores being created within each of the first plurality of pores, and a plurality of the third plurality of pores being created within each of the second plurali…

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What does patent US8961855B2 cover?
A method of forming a high aspect ratio adhesive structure, the method comprising fabricating a porous template comprising at least a first tier and a second tier; introducing a softened polymer into the template; and separating the polymer from the template.
Who is the assignee on this patent?
Ho Yoke Yee Audrey, Rodriguez Fernandez Isabel, Agency Science Tech & Res
What technology area does this patent fall under?
Primary CPC classification B29C59/022. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).