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Apparatus and method of fabricating flat plate display
US8961851B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8961851-B2 |
| Application number | US-91364910-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 27, 2010 |
| Priority date | Dec 23, 2009 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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Abstract
Official abstract text for this publication.
A fabricating apparatus and a method of a flat plate display are disclosed. A fabricating apparatus of a flat plate display includes a stage on which a substrate having liquid resin formed thereon is seated, a imprinting mold bonded with the liquid resin of the substrate to form a thin film pattern on the substrate, the imprinting mold comprises projections and grooves, and a planarization layer formed between the stage and the substrate to planarize a surface of the stage.
First claim
Opening claim text (preview).
What is claimed is: 1. A fabricating method of a flat plate display comprising steps of: forming a planarization layer on a stage to planarize a surface of the stage; seating a substrate having liquid polymeric precursor formed thereon on the planarization layer; bonding an imprinting mold and the substrate with each other, the imprinting mold comprising grooves and projections to press the liquid polymeric precursor to form a thin film pattern having a shape transferred from…
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Classifications
- G03F7/0002Primary
Physics · mapped topic
- G09F9/30Primary
Physics · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US8961851B2 cover?
- A fabricating apparatus and a method of a flat plate display are disclosed. A fabricating apparatus of a flat plate display includes a stage on which a substrate having liquid resin formed thereon is seated, a imprinting mold bonded with the liquid resin of the substrate to form a thin film pattern on the substrate, the imprinting mold comprises projections and grooves, and a planarization laye…
- Who is the assignee on this patent?
- Kim Ju-Hyuk, Song Tae-Joon, Cho Seong-Pil, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification G03F7/0002. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).